Inside an IC Sandbox · Introduction to Information Technology

Integrated circuitSN7400 · 1970s TTL, DIP-14

Anatomy of the chip

1Silicon die. The real circuit — thousands of transistors built on a single crystal.
2Metal traces. Tiny wires that connect the transistors into logic gates and memories.
3Bond wires. Fine gold threads that carry signals from the die out to the lead frame.
4Lead frame. A stamped metal skeleton inside the package linking wires to the pins.
5Pins. The only part you touch — plugging into a socket or soldered to a board.

This is a DIP-14 — a dual in-line package with two rows of pins. The notch and pin-1 dot mark orientation so the chip is never inserted backwards. The black epoxy body is just a protective shell; all the electronics live on the tiny die inside.

Pins

Package

DIP

Die

Sisilicon

Connections

wiresgold

Rotate the model to inspect every side. Switch to "Inside" to lift the lid and see the die, bond wires and lead frame that make the chip work.

Drag to rotate · scroll to zoom